Provided are a solder ball supply method, a solder ball supply device, and a solder bump forming method that are compatible with electrodes of a fine pitch without flux. A substrate 70 is prepared in which a resist 74 having an opening 76 is disposed on an electrode 72 having a diameter of 10 to 30 μm of the substrate 70 (FIG. 3A). Next, a plurality of solder balls SBL having a particle diameter of 1 to 10 μm are shaken down from the hopper 22 and filled into the openings 76 of the resist 74 (FIGS. 3B and 3C). Next, by sliding the squeegee 32 in the XY direction on the upper surface of the resist 74, the solder balls SBL shaken off other than the opening 76 are scraped off from the upper surface of the resist 74 and the inside of the opening 76 is removed. And the solder ball SBL in the periphery thereof is pushed into the opening 76 by the squeegee 32 (FIGS. 3D and 3E). As a result, the opening 76 of the resist 74 can be filled with the solder balls SBL at a high density.
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