METHODS OF FORMING A MICROELECTRONIC DEVICE STRUCTURE, AND RELATED MICROELECTRONIC DEVICE STRUCTURES AND MICROELECTRONIC DEVICES

摘要

A method of forming a microelectronic device structure comprises coiling a portion of a wire up and around at least one sidewall of a structure protruding from a substrate. At least one interface between an upper region of the structure and an upper region of the coiled portion of the wire is welded to form a fused region between the structure and the wire.