HIGH ASPECT RATIO INTERCONNECT FOR WAFER LEVEL PACKAGE (WLP) AND INTEGRATED CIRCUIT (IC) PACKAGE

摘要

A package (e.g., wafer level package) that includes a die, a redistribution portion coupled to the die, a first high aspect ratio (HAR) interconnect coupled to the redistribution portion of the package, where the first high aspect ratio (HAR) interconnect comprises a width to height ratio of about at least 1:2, and a first solder interconnect coupled to the first high aspect ratio (HAR) interconnect and the redistribution portion. In some implementations, the first high aspect ratio (HAR) interconnect is a composite interconnect that includes a first conductive core and a first conductive layer that at least partially encapsulates the first conductive core. In some implementations, the first conductive layer is a diffusion barrier.