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Predictive wafer modeling based focus error prediction using correlations of wafers

机译:使用晶圆相关性的基于可预测晶圆建模的聚焦误差预测

摘要

Predictive modeling based focus error prediction method and system are disclosed. The method includes obtaining wafer geometry measurements of a plurality of training wafers and grouping the plurality of training wafers to provide at least one training group based on relative homogeneity of wafer geometry measurements among the plurality of training wafers. For each particular training group of the at least one training group, a predictive model is develop utilizing non-linear predictive modeling. The predictive model establishes correlations between wafer geometry parameters and focus error measurements obtained for each wafer within that particular training group, and the predictive model can be utilized to provide focus error prediction for an incoming wafer belonging to that particular training group.
机译:公开了基于预测建模的聚焦误差预测方法和系统。该方法包括获得多个训练晶片的晶片几何测量结果,并且基于多个训练晶片之间的晶片几何测量结果的相对均匀性,将多个训练晶片分组以提供至少一个训练组。对于至少一个训练组中的每个特定训练组,利用非线性预测建模来建立预测模型。预测模型建立了晶片几何参数与为该特定训练组内的每个晶片获得的聚焦误差测量之间的相关性,并且该预测模型可用于为属于该特定训练组的进入晶片提供聚焦误差预测。

著录项

  • 公开/公告号US9707660B2

    专利类型

  • 公开/公告日2017-07-18

    原文格式PDF

  • 申请/专利权人 KLA-TENCOR CORPORATION;

    申请/专利号US201414457706

  • 申请日2014-08-12

  • 分类号G06F15/18;B24B37/005;B24B49;G03F7/20;G01B21;G06N7;G06N99;G03F9;

  • 国家 US

  • 入库时间 2022-08-21 13:46:15

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