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Land grid array socket for electro-optical modules

机译:用于电光模块的接地栅格阵列插座

摘要

An LGA socket suitable for electro-optical modules, such as transceivers having channels operable at 25 Gbit/s, or greater. A socket may include a socket body having a bottom side to face a printed circuit board (PCB), and a backstop on a top side to receive a leading edge of a module substrate. The backstop has an overhang to contact a first side of the module substrate when seated into the socket body. The socket further includes a first and a second row of electrical contacts, the first row being more proximate to the backstop than is the second row. Contacts extend through the socket body between the top and bottom sides and are positioned relative to the overhang to be compressed against contact pads on a second side of the module substrate by a torque applied to the module substrate about a fulcrum within the socket body.
机译:适用于电光模块的LGA插座,例如收发器,其通道的工作速率为25 Gbit / s或更高。插座可以包括插座主体,该插座主体的底侧面对印刷电路板(PCB),并且在顶侧上的挡块用于容纳模块基板的前缘。所述止挡件具有悬垂部,以在安装到所述插座主体中时接触所述模块基板的第一侧。插座还包括第一和第二排电触头,第一排比第二排更靠近逆止器。触头在顶侧和底侧之间延伸穿过插座主体,并且相对于突出部定位,以通过围绕插座主体内的支点施加到模块基板的扭矩而抵靠模块基板第二侧上的接触垫压缩。

著录项

  • 公开/公告号US9627809B2

    专利类型

  • 公开/公告日2017-04-18

    原文格式PDF

  • 申请/专利权人 INTEL CORPORATION;

    申请/专利号US201314127534

  • 发明设计人 GLEN GORDON;

    申请日2013-09-13

  • 分类号H01R13/6582;H01R12/83;H01R13/629;H01R4/48;H01R12/70;H01R43/20;G02B6/42;

  • 国家 US

  • 入库时间 2022-08-21 13:45:13

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