METHOD TO PROVIDE DIE ATTACH STRESS RELIEF USING GOLD STUD BUMPS

摘要

An integrated circuit is attached to a substrate with a controlled stand-offheight,by mounting a plurality of stud bumps of the controlled stand-off height tothe substrate atpredetermined locations, placing adhesive dots over the stud bumps, placingthe integratedcircuit on the substrate over the adhesive dots, and applying downwardpressure on the integratedcircuit until the integrated circuit is in mechanical contact with the studbumps.