METHOD TO PROVIDE DIE ATTACH STRESS RELIEF USING GOLD STUD BUMPS

摘要

An integrated circuit (36) is attached to a substrate (30) with a controlled stand-off height, by mounting a plurality of stud bumps (32) of the controlled stand-off height to the substrate (30) at predetermined locations, placing adhesive dots (34) over the stud bumps (32), placing the integrated circuit (36) on the substrate (30) over the adhesive dots (34), and applying downward pressure on the integrated circuit (36) until the integrated circuit is in mechanical contact with the stud bumps (32).