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Method to provide die attach stress relief using gold stud bumps
Method to provide die attach stress relief using gold stud bumps
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机译:使用金钉凸块提供裸片附着应力消除的方法
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摘要
An integrated circuit is attached to a substrate with a controlled stand-off height, by mounting a plurality of stud bumps of the controlled stand-off height to the substrate at predetermined locations, placing adhesive dots over the stud bumps, placing the integrated circuit on the substrate over the adhesive dots, and applying downward pressure on the integrated circuit until the integrated circuit is in mechanical contact with the stud bumps.
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