Stud Bumping and Die Attach for Expanded Flip Chip Applications

摘要

A good form factor and excellent electrical performance are enabling flip chip bonding to emerge as one of the high growth areas of semiconductor assembly. Growth of this bonding technique will accelerate as substrate prices fall and a manufacturing infrastructure is developed. Gold stud bumps with gold-gold (Au-Au) interconnect (GGI) have developed as a niche segment of the flip chip market. Gold stud bumping uses a variation of traditional wire bond technology to generate gold bumps on a wafer. After bumping, a wafer is diced and flipped, then thermal-sonically welded to the gold-plated substrate. Metallurgi-cally, a monometallic thermalsonic weld has higher strength and reliability than a solder joint produced by conventional flip chip methods. Joint development of the stud bump and flip chip die attach process, with optimization of all processes, provides a faster development path than a single party development. These partnerships advance the capabilities of the industry by providing a complete solution.