METHOD OF MANUFACTURING FAN-OUT WAFER-LEVEL PACKAGE

摘要

A method of manufacturing a fan-out wafer-level package, comprising the following steps: mounting a chip (1) on an upper surface of a substrate (6) using a binder (7); performing plastic packaging formation on the upper surface of the substrate (6), wherein a plastic package material layer (2) packages the chip (1); applying a dielectric material on an upper surface of the plastic package material layer (2) to form a dielectric layer (4); removing the dielectric layer (4) at positions corresponding to input and output ends of the chip (1), then forming a lead-out line (3) and a solder ball (8) at the removal positions; performing thinning along a lower surface of the substrate (6); removing the substrate (6), binder (7) and part of the lower surface of the plastic package material layer (2) and the chip (1) such that an ultimate grinding surface is at a preset position of the chip (1) to form a packaged semi-finished product; and cutting along a cutting line between two adjacent chips on the packaged semi-finished product to form individual packaged structures from the packaged semi-finished product. The invention can greatly reduce process steps in the process of fan-out packaging and greatly reduce packaging costs while ensuring packaging reliability.