PACKAGE FOR HOUSING ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

摘要

A package for housing an electronic component includes: a base having a first main surface that has a part for mounting an electronic component; a frame having a second main surface, said frame being provided on the the base so as to surround the mounting part; a frame-shaped metallized layer provided on the second main surface of the frame; and a side-surface conductor via which the frame-shaped metallized layer and a relay conductor formed on the first main surface are connected, said side-surface conductor being provided on the inner side surface of the frame. An insulation film covers from one end to the other end in the width direction of the side-surface conductor.