HEAT DISSIPATION MODULE FOR IGBT MODULE AND IGBT MODULE HAVING SAME

摘要

Provided are an IGBT heat dissipation module (1000) and an IGBT module having the same. The IGBT heat dissipation module (1000) comprises a radiator bottom plate (100), which comprises a bottom plate body (10) and N heat dissipation columns (20). The bottom plate body (10) comprises a body portion (13), and a first surface layer (11) and a second surface layer (12) respectively provided on opposing surfaces of the body portion (13). The N heat dissipation columns (20) are disposed apart from each other on the first surface layer (11), and one end of each heat dissipation column (20) is fixed to the first surface layer (11) and the other end is free end (21). The first surface layer (11) and the heat dissipation columns (20) are both adapted for contact with cooling liquid. The area on the first surface layer (11) which is in contact with the cooling liquid is S1, and the area on the first surface layer (11) which is in contact with each of the heat dissipation columns (20) is S2, wherein 180≤S1/S2≤800, and 300≤N＜650. Moreover, a copper clad laminate (200) is mounted on the second surface layer (12). An IGBT module with the above IGBT heat dissipation module has good heat dissipation effect, high yield and low production cost.