HEAT DISSIPATION MODULE FOR IGBT MODULE AND IGBT MODULE COMPRISING SAME

摘要

The present disclosure provides a heat dissipation module for an IGBT module and an IGBT module comprising same. The heat dissipation module comprises: a radiator base plate, the radiator base plate comprising: a base plate body and N heat-dissipation columns, the base plate body comprising a body portion and a first skin and a second skin provided respectively on two opposite surfaces of the body portion, the body portion being made of aluminum silicon carbide, the N heat-dissipation columns being spaced apart on the first skin, and one end of each heat-dissipation column being fixed to the first skin and the other end thereof being a free end, both the first skin and the N heat-dissipation columns being suitable for contacting a cooling liquid; and a copper clad laminate, the copper clad laminate comprising a substrate, a first copper layer and a second copper layer, the first copper layer and the second copper layer being respectively provided on two opposite surfaces of the substrate, and the thickness of the first copper layer being less than the thickness of the second copper layer, the first copper layer being provided on the second skin.