The present invention relates to a novel process for the production of high conductivity metal films or patterns by double low temperature sintering using carbon coated copper nanoparticles. The low temperature-sintering process of the present invention is carried out in two stages of an oxidation process and a reduction process, more specifically, an oxidation process for 5 minutes to 30 minutes and a reduction process for 5 minutes to 30 minutes. The metal film or pattern of the present invention produced through the double low temperature-sintering process exhibits high conductivity characteristics due to the low electric resistance value through the formation and growth of the copper nanoparticles. Thus, the present invention not only enables the formation of a highly conductive metal film or pattern on a substrate, more specifically a flexible substrate, using copper nanoparticle ink / paste, but also provides a much better electrical property than conventionally used polymeric materials It can be applied industrially usefully.
展开▼
