E-WLB E-PLB WLCSP METHOD OF EMBEDDING WLCSP COMPONENTS IN E-WLB AND E-PLB

摘要

The present invention provides a multi-die package. A multi-die package, comprising: a mold layer having a first surface and a second surface opposite the first surface, one or more first electrical components, each of the first electrical components being oriented to face a first surface of the mold layer And one or more second electrical components, each of the second electrical components having a second type of terminal that is oriented to face a second surface of the mold layer.