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OPTOELECTRONIC SEMICONDUCTOR COMPONENT, DEVICE FOR RECORDING IMAGE INFORMATION AND METHOD FOR PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT

机译:光电半导体组件,用于记录图像信息的装置以及用于制造光电半导体组件的方法

摘要

In at least one embodiment of the optoelectronic semiconductor device, this comprises at least one connection carrier, at least one optoelectronic semiconductor chip, which is attached to a front side of the connection carrier, and at least two springs for electrically contacting the semiconductor device. The springs are in this case applied to one of the front side opposite the rear side of the connection carrier, the spring forces of the springs have a component perpendicular to the back of the connection carrier. Such an optoelectronic semiconductor device is easy to manufacture and can be contacted in a particularly simple manner electrically with an external device.
机译:在光电子半导体器件的至少一个实施例中,其包括至少一个连接载体,至少一个光电子半导体芯片和至少两个用于电接触半导体器件的弹簧,所述光电子半导体芯片附接到连接载体的前侧。在这种情况下,弹簧被施加到与连接载体的后侧相对的前侧之一,弹簧的弹力具有垂直于连接载体的后部的分量。这种光电子半导体器件易于制造并且可以以特别简单的方式与外部器件电接触。

著录项

  • 公开/公告号EP3333907A1

    专利类型

  • 公开/公告日2018-06-13

    原文格式PDF

  • 申请/专利权人 OSRAM OPTO SEMICONDUCTORS GMBH;

    申请/专利号EP20180151689

  • 发明设计人 ENGL MORITZ;

    申请日2009-02-18

  • 分类号H01L33;H01L33/62;H01L33/48;

  • 国家 EP

  • 入库时间 2022-08-21 13:16:57

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