POLYIMIDE, ADHESIVE, FILM-LIKE ADHESIVE, ADHESION LAYER, ADHESIVE SHEET, COPPER FOIL WITH RESIN, COPPER-CLAD LAMINATE, PRINTED WIRING BOARD, AND MULTILAYER WIRING BOARD AND METHOD FOR PRODUCING THE SAME

摘要

To provide a polyimide, an adhesive, a film-like adhesive, an adhesion layer, an adhesive sheet, a copper foil with resin, a copper-clad laminate, a printed wiring board, and a multilayer wiring board and a method of producing the same.SOLUTION: The present invention provides: a polyimide that is a reactant of a monomer group containing an aromatic tetracarboxylic acid anhydride containing a symmetric aromatic tetracarboxylic acid anhydride and a diamine containing an aromatic diamine and a dimer diamine; an adhesive containing the polyimide, a crosslinker and an organic solvent; and a film-like adhesive, an adhesion layer, an adhesive sheet, a copper foil with resin, a copper-clad laminate, a printed wiring board, and a multilayer wiring board and a method of producing the same.SELECTED DRAWING: None