POLYIMIDE, POLYIMIDE-BASED ADHESIVE, FILM-LIKE ADHESIVE MATERIAL, ADHESIVE LAYER, ADHESIVE SHEET, COPPER FOIL WITH RESIN, COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD, AND MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a new polyimide exhibiting high storage modulus of rigidity even on a B-stage temperature condition; a new polyimide-based adhesive which is a composition using the polyimide and provides an adhesive layer having good adhesion, heat-resistant adhesiveness, flow controllability and low dielectric characteristics; and a film-like adhesive material obtained by the adhesive.SOLUTION: There are provided polyimide (1) which is a reactant of a monomer group containing an aromatic tetracarboxylic acid anhydride (A) and diamine (B) containing dimer diamine (b1) and trimer triamine (b2) so that a mass ratio [(b1)/(b2)] is in a range of 97/3 to 70/30; a polyimide-based adhesive containing the (1) component, a crosslinking agent (2) and an organic solvent (3); and a film-like adhesive material obtained from the polyimide-based adhesive.SELECTED DRAWING: Figure 1