METHOD FOR MANUFACTURING COPPER-NICKEL ALLOY SPUTTERING TARGET AND COPPER-NICKEL ALLOY SPUTTERING TARGET

摘要

To provide a method for manufacturing a copper-nickel alloy sputtering target having a grain size comparatively fine and small in variation, having sufficiently high density and capable of stably depositing a copper-nickel alloy thin film.SOLUTION: A method for manufacturing a copper-nickel alloy sputtering target containing Ni of 15 mass% or more and 80 mass% or less and the remainder consisting of Cu and inevitable impurities includes a sintering step S04 of holding a sintering raw material including a nickel containing raw material and a copper raw material at a sintering temperature higher than the melting point of the copper raw material and lower than the solidus line temperature of copper-nickel alloy constituting the copper-nickel alloy sputtering target in a reducing atmosphere or a vacuum atmosphere. In the sintering step S04, a Cu liquid phase obtained by melting the copper raw material is generated in a state held at the sintering temperature and is solidified by diffusing Ni atoms of the nickel containing raw material in the Cu liquid phase.SELECTED DRAWING: Figure 2