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METAL CONTAMINATION PREVENTION METHOD AND FILM FORMATION APPARATUS

机译:金属污染的预防方法和成膜装置

摘要

PROBLEM TO BE SOLVED: To provide a metal contamination prevention method and a film formation apparatus capable of preventing metal contamination occurring at a time of cleaning the film formation apparatus.SOLUTION: The metal contamination prevention method performed after dry cleaning of a processing chamber used for film formation processing and before film formation is started, includes: a temperature changing step of changing the inside of the processing chamber from a temperature during dry cleaning to a predetermined film forming temperature; an activation step of supplying hydrogen and oxygen into the processing chamber after the temperature changing step and activating the hydrogen and oxygen in the processing chamber; and a step of performing a film forming process in a state in which the substrate is not present in the processing chamber after performing the activating step, and coating the inside of the processing chamber.SELECTED DRAWING: Figure 10
机译:解决的问题:提供一种能够防止在清洗成膜装置时发生的金属污染的防止金属污染的方法和成膜装置。膜形成处理和在膜形成开始之前,包括:温度改变步骤,其将处理室内部从干洗期间的温度改变为预定的膜形成温度;以及在温度改变步骤之后,将氢和氧供应到处理室中并激活处理室中的氢和氧的激活步骤;进行活化工序后,在处理室内不存在基板的状态下进行成膜处理,并对处理室内进行涂布。图10

著录项

  • 公开/公告号JP2018170307A

    专利类型

  • 公开/公告日2018-11-01

    原文格式PDF

  • 申请/专利权人 TOKYO ELECTRON LTD;

    申请/专利号JP20170064368

  • 发明设计人 UMEHARA TAKAHITO;

    申请日2017-03-29

  • 分类号H01L21/31;C23C16/44;

  • 国家 JP

  • 入库时间 2022-08-21 13:13:36

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