CARRIER-FITTED COPPER FOIL, METHOD FOR MANUFACTURING CARRIER-FITTED COPPER FOIL, PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, COPPER-CLAD LAMINATE SHEET, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a carrier-fitted copper foil exhibiting a high adhesion force between a carrier and an ultrathin copper foil before a step of being laminated on an insulating substrate but easily peelable via the carrier-ultrathin copper foil interface after the laminating step.SOLUTION: The roughened layer surface roughness Rz of the ultrathin copper layer of the provided carrier-fitted copper foil is 1.6 m or less. The intermediate layer thereof comprises Ni. In a case where, on an occasion for peeling the ultrathin copper layer in compliance with JIS C 6471, the Cr atom concentration (%), Zn atom concentration (%), Ni atom concentration (%), Cu atom concentration (%), total O atom concentration (%), C atom concentration (%), and the concentration of other atoms (%) along the depth direction ascertained as a result of X-ray photoelectron spectroscopic (XPS) surface analysis (x: unit nm) are defined respectively as e(x), f(x), g(x), h(x), i(x), j(x), and k(x), g(x)dx/(e(x)dx+f(x)dx+g(x)dx+h(x)dx+i(x)dx+j(x)dx+k(x)dx) satisfies the condition of 5.0% or less within the zone [0, 1.0] of analysis along the direction of depth from the intermediate layer-side surface of the ultrathin copper layer.