Thermosetting resin composition, prepreg, resin-attached film, laminated board, multilayer printed wiring board and semiconductor package

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition that is excellent in glass transition temperature (Tg), low thermal expansion property, low shrinkage property and high modulus of elasticity, and to provide a prepreg, film with resin, laminate sheet and printed circuit board using the same.SOLUTION: Provided are: a thermosetting resin composition having a weight average molecular weight in a range of 6500 to 85000, in which an amino-modified siloxane compound having an aromatic azomethine group in the molecular structure (a), and a maleimide compound having at least two N-substituted maleimide groups in the molecular structure (b) are formulated; and a prepreg, film with resin, laminate sheet, multilayer printed circuit board and semiconductor package using the same.