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Testing Multilayer Printed Wiring Board Prepreg by Differential-Scanning Calorimetry. Final Report

机译：用差示扫描量热法测试多层印刷线路板预浸料。总结报告

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摘要

A simplified receiving inspection test for epoxy/glass prepreg was developed. This test, which could replace the resin flow test, uses differential scanning calorimetry to measure the glass transition temperature. The glass transition temperature was found to correlate well with the resin flow test. (ERA citation 81:026049)

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作者
Scott, D. A.; Lula, J. W.;
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作者单位

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年度 1981
页码 p.1-23
总页数 23
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
Printed circuits; Calorimetry; Epoxides; Glass; Layers; Materials testing; Resins; Transition temperature;

机译：印刷电路;量热法;环氧化物;玻璃;层;材料测试;树脂;转变温度;

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专利

1. Influence of dynamic parallelism of hot press on discrepancy of multilayer printed wiring boards - study on precise adhesion technology of multilayer printed wiring boards IV [J] . Hideyasu Murooka, Masayuki Kyooi, Hiroya Murakami, 塑性と加工 . 1997,第438期

机译：热压动态平行度对多层印刷线路板差异的影响-多层印刷线路板精密粘合技术的研究IV
2. Influence of dynamic parallelism of hot press on discrepancy of multilayer printed wiring boards - study on precise adhesion technology of multilayer printed wiring boards IV [J] . Hideyasu Murooka, Masayuki Kyooi, Hiroya Murakami, 塑性と加工 . 1997,第438期

机译：热压机动态平行性对多层印刷线板差异的影响 - 多层印刷配线板精确粘合技术研究IV
3. Prepreg cutting method using heating-assist by CO{sub}2 laser for printed wiring board [J] . Yoshiyuki Kaji, Tetsuya Okuchi, Koji Kusada 松下電工技報 . 2002,第78期

机译：CO {sub} 2激光辅助加热的印制电路板预浸料切割方法
4. Development of Halogen-free Prepreg Available for Additive Process in Order to Attain Ultra-fine Printed Wiring Boards [C] . Tomoaki Iwami, Tomoaki Watanebe, Hiroaki Fujiwara, 第十一届世界电子电路大会论文集 . 2008

机译：开发无卤预浸料，可用于加成工艺，以获得超细印刷线路板
5. Large-area, low-cost via formation and metallization in multilayer thin film interconnection on printed wiring boards (PWB) [D] . Li, Weiping 1999

机译：印刷线路板（PWB）上多层薄膜互连中的大面积，低成本通孔形成和金属化
6. Integrated multilayer stretchable printed circuit boards paving the way for deformable active matrix [O] . Shantonu Biswas, Andreas Schoeberl, Yufei Hao, -1

机译：集成多层可拉伸印刷电路板为可变形有源矩阵铺平了道路
7. Testing the interlaminate adhesion of multilayer printed wiring boards [O] . J.W. Lula 1978

机译：测试多层印刷线路板的Interlamate粘附

Testing Multilayer Printed Wiring Board Prepreg by Differential-Scanning Calorimetry. Final Report

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