Semiconductor manufacturing device component and method for manufacturing semiconductor manufacturing device component

摘要

In this specification, the technique which can suppress the fall of the joint strength of a 1st ceramic member and a 2nd ceramic member is disclosed. A component for a semiconductor manufacturing apparatus includes a first ceramic member formed of a material mainly composed of AlN, a second ceramic member formed of a material mainly composed of AlN, a first ceramic member, And a bonding layer that is disposed between the two ceramic members and bonds the first ceramic member and the second ceramic member. The bonding layer includes a composite oxide containing Gd and Al and Al2O3, and does not contain AlN.