BONDING WIRE, WIRE BONDING METHOD USING THE BONDING WIRE, AND ELECTRICAL CONNECTION PART OF SEMICONDUCTOR DEVICE USING THE BONDING WIRE

摘要

A bonding wire includes a wire core including a silver-palladium alloy, and a coating layer disposed on a sidewall of the wire core. A palladium content of the silver-palladium alloy ranges from about 0.1 wt % to about 1.5 wt %.