首页>
外国专利>
Composition for metal electroplating comprising an additive for bottom-up filling of through-silicon vias and interconnect features
Composition for metal electroplating comprising an additive for bottom-up filling of through-silicon vias and interconnect features
展开▼
机译:用于金属电镀的组合物,其包含用于自底向上填充硅通孔和互连部件的添加剂
展开▼
页面导航
摘要
著录项
相似文献
摘要
A composition comprising a source of metal ions and at least one polyaminoamide, said polyaminoamide comprising amide and amine functional groups in the polymeric backbone and aromatic moieties attached to or located within said polymeric backbone.
展开▼