首页>
外国专利>
- COMPOSITION FOR METAL ELECTROPLATING COMPRISING AN ADDITIVE FOR BOTTOM-UP FILLING OF THROUGH SILICON VIAS AND INTERCONNECT FEATURES
- COMPOSITION FOR METAL ELECTROPLATING COMPRISING AN ADDITIVE FOR BOTTOM-UP FILLING OF THROUGH SILICON VIAS AND INTERCONNECT FEATURES
展开▼
机译:-用于金属电镀的成分,包括通过硅罐底部填充和互连特征的添加剂
展开▼
页面导航
摘要
著录项
相似文献
摘要
The present invention relates to a composition comprising a metal ion source and at least one polyaminoamide, wherein the polyaminoamide includes a mining functionality and an aromatic moiety located within or attached to the polymer backbone within the amide and polymer backbone.
展开▼