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Compositions for metal electroplating including additives for bottom-up filling of through-silicon vias and interconnect features
Compositions for metal electroplating including additives for bottom-up filling of through-silicon vias and interconnect features
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机译:用于金属电镀的成分,包括用于自下而上填充硅通孔和互连部件的添加剂
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摘要
A composition comprising a source of metal ions and at least one polyaminoamide, said polyaminoamide comprising amide and amine functional groups in the polymeric backbone and aromatic moieties attached to or located within said polymeric backbone.
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