IMPEDANCE MATCHING SYSTEM, IMPEDANCE MATCHING METHOD AND SEMICONDUCTOR PROCESSING EQUIPMENT

摘要

An impedance matching system (20), an impedance matching method and a semiconductor processing equipment. The impedance matching system (20) comprises: an impedance matching device (21), which is provided between an RF power source (10) and a reaction chamber (60), which can be connected to both the RF power source (10) and the reaction chamber (60), respectively, and which is used for automatically impedance matching between the output impedance of the RF power source (10) and the input impedance of the impedance matching device (21); a selecting switch (22) and a load circuit, the selecting switch (22) being used for selectively connecting the RF power source (10) to the reaction chamber (60) or to the load circuit; a control unit (24), which is used for, according to a preset time sequence, controlling the selecting switch (22) to connect the RF power source (10) to the reaction chamber (60), or the RF power source (10) to the load circuit, such that a continuous waveform output of the RF power source (10) is converted into a pulse output and supplied to the reaction chamber (60). The impedance matching system, the impedance matching method and the semiconductor processing equipment enable a continuous waveform RF power source (10) to analog pulse waveform patterns, thereby reducing system and equipment costs, improving economic benefits, and avoiding the overshoot phenomenon in the process of loading pulse RF power signals to the reaction chamber (60).