Patent application title: Copper foil having a carrier, a method for producing the same, and a method for manufacturing a coreless support and a printed wiring board having a wiring layer

摘要

The antireflection layer at the time of formation of the wiring layer on the surface of the coreless support exhibits excellent chemical resistance to the copper flash etching solution and at the time of image inspection after the copper flash etching it is possible to obtain excellent visibility of the wiring layer by contrast with the antireflection layer. Is provided. The copper foil having the carrier is formed of a carrier, a peeling layer provided on the carrier, and at least one metal selected from the group consisting of Cr, W, Ta, Ti, Ni and Mo, And an ultra-thin copper layer provided on the antireflection layer, and the surface of at least the ultra-thin copper layer side of the antireflection layer is an aggregate of metal particles.