Patent application title: Copper foil with carrier, laminate for coreless support, coreless support with wiring layer, and method for producing printed wiring board

摘要

PROBLEM TO BE SOLVED: To provide a carrier-fitted copper foil exhibiting excellent characteristics even in any of peeling resistance to a developer, the film thickness distribution uniformity of boundary metal and etching selectivity, in the production process for a printed circuit board (particularly, in an RDL-First process).SOLUTION: Provided is a carrier-fitted copper foil comprising: a carrier; a nickel alloy layer provided on the carrier and composed of a nickel alloy having a nickel content of 45 to 98 wt.%; a carbon layer provided on the nickel alloy layer and mainly including carbon; and an extra-thin copper layer provided on the carbon layer.SELECTED DRAWING: Figure 1