POLYMER OF POLYIMIDE PRECURSOR POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION PATTERNING PROCESS METHOD FOR FORMING CURED FILM INTERLAYER INSULATING FILM SURFACE PROTECTIVE FILM AND ELECTRONIC PARTS

摘要

In the present invention, provided is a polymer of a polyimide precursor, the polymer which can be solved in an aqueous alkaline solution, can form a fine pattern, can obtain a high resolution, and can be used as a base resin for positive-type and negative-type photosensitive resin compositions. In addition, in the present invention, provided are positive-type and negative-type photosensitive resin compositions prepared by using the polymer of a polyimide precursor. Moreover, in the present invention, provided are a method for forming a pattern by using the composition and a method for forming a cured film by using the composition. In the present invention, provided is the polymer of a polyimide precursor comprising a structure unit represented by general formula (1).