首页> 外国专利> A method of producing a vanadium-doped SiC bulk single crystal and a vanadium-doped SiC substrate

A method of producing a vanadium-doped SiC bulk single crystal and a vanadium-doped SiC substrate

机译:一种掺杂钒的SiC块体单晶的方法和掺杂钒的SiC衬底

摘要

Method for producing at least one semi-insulating bulk SiC crystal (2; 33) having a specific electrical resistance of at least 10 Ωcm and intended for the production of semiconductor and / or high-frequency components, wherein a) at least one crystal growth region (5, 36) of a growth crucible (3; SiC growth gas phase (9; 38) is generated and the SiC bulk single crystal (2; 33) is grown by deposition from the SiC growth gas phase (9; 38), b) the SiC growth gas phase (9; 38) is made of a SiC Source material (6; 31) located in a SiC storage area (4; 35) within the cultivation crucible (3; 34), material transport from the SiC storage area (4; 35) to a growth interface (3); C) the crystal growth region (5; 36) is supplied with vanadium as a dopant of the growing SiC bulk single crystal (2; 33), d) at the growth interface che (16; 39) of the growing SiC bulk single crystal (2; 33) is set at a growth temperature of at least 2250 ° C such that the SiC bulk single crystal (2; 33) doped with a vanadium dopant concentration greater than 5 x 10 cm grows, e) the material transport from the SiC storage area (4; 35) to the growth interface (16; 39) in addition to the temperature conditions prevailing in the culturing crucible (3; 34) by means of a further transport control measure (18; 25; 28; 31; 41) such that the growth temperature at the growth interface (16; 39) and the material transport to the growth interface (16; 39) can be influenced independently of one another.
机译:制备至少一种具有至少10Ωcm的电阻率且用于生产半导体和/或高频组件的半绝缘块状SiC晶体(2; 33)的方法,其中a)至少生长一种晶体产生生长坩埚(3; SiC生长气相(9; 38))的区域(5、36),并通过从SiC生长气相(9; 38)沉积来生长SiC块状单晶(2; 33)。 b)SiC生长气相(9; 38)由位于栽培坩埚(3; 34)内SiC储存区域(4; 35)中的SiC源材料(6; 31)制成, SiC存储区(4; 35)到生长界面(3); C)在生长的SiC块状单晶的生长界面che(16; 39)处向晶体生长区域(5; 36)提供钒作为生长的SiC块状单晶(2; 33),d)的掺杂剂。将(2; 33)的生长温度设置为至少2250°C,以使掺杂有钒掺杂剂浓度大于5 x 10 cm的SiC块状单晶(2; 33)生长,e) SiC储存区域(4; 35)到生长界面(16; 39)的位置,以及通过其他传输控制措施(18; 25; 28; 31; 41),从而可以彼此独立地影响生长界面(16; 39)处的生长温度和向生长界面(16; 39)的材料传输。

著录项

  • 公开/公告号DE102014217956B4

    专利类型

  • 公开/公告日2018-05-09

    原文格式PDF

  • 申请/专利权人 SICRYSTAL AG;

    申请/专利号DE201410217956

  • 申请日2014-09-09

  • 分类号C30B23/02;C30B29/36;

  • 国家 DE

  • 入库时间 2022-08-21 12:35:01

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