Cooling structure for an electronic device

摘要

A cooling structure (50a) for an electronic device, is designed in such a way that they inner heat dissipator fins (52a) (first) heat dissipating element in the interior of a casing (22) and serving as a circuit substrate on a printed circuit board (20) are arranged, and outer heat dissipator fins (54a) (second heat dissipating element), of which a section outside the casing (22) is exposed. The outer heat dissipator fins (54a) comprise a heat entry lamellae element (58a), which in a first heat removal lamellae element (56a) is inserted, the inner heat dissipator fins (52a) and a second heat removal lamellae element (60), the outside the casing (22) is exposed. A heat transfer member (62a), which is adapted, heat from the heat entry lamellae element (58a) to the second heat removal lamellae element (60a), is between the heat entry lamellae element (58a) and the second heat removal lamellae element (60a) positioned.