Electronics, cooling structure for an electronic device, and dust in the cooling structure for an electronic device, drip method

摘要

Providing a cooling structure of an electronic device can be employed a forced air cooling method using a fan while maintaining dust and drip-proofness. Housing a heating element such as IC or LSI is mounted, is formed inlet air (10) an exhaust port (11) and (2), housing the cooling structure of the electronic device (2) in The intercept with the outside world fan mounted (9), fan (9), and a filter water repellent coating such as fluorine has been subjected to, and (7,13). It can be forced air cooling Thus, while maintaining dust of electronic devices, the robustness of the drip, etc., using a fan and it is possible to ensure thermal performance greater than air.