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GE AND III-V CHANNEL SEMICONDUCTOR DEVICES HAVING MAXIMIZED COMPLIANCE AND FREE SURFACE RELAXATION

机译:GE和III-V通道半导体器件具有最大的顺应性和自由的表面松弛

摘要

Ge and III-V channel semiconductor devices having maximized compliance and free surface relaxation and methods of fabricating such Ge and III-V channel semiconductor devices are described. For example, a semiconductor device includes a semiconductor fin disposed above a semiconductor substrate. The semiconductor fin has a central protruding or recessed segment spaced apart from a pair of protruding outer segments along a length of the semiconductor fin. A cladding layer region is disposed on the central protruding or recessed segment of the semiconductor fin. A gate stack is disposed on the cladding layer region. Source/drain regions are disposed in the pair of protruding outer segments of the semiconductor fin.
机译:描述了具有最大柔度和自由表面松弛的Ge和III-V沟道半导体器件,以及制造这种Ge和III-V沟道半导体器件的方法。例如,半导体器件包括设置在半导体衬底上方的半导体鳍。半导体鳍片具有沿着半导体鳍片的长度与一对突出的外部片段间隔开的中央突出或凹陷片段。包层区域设置在半导体鳍片的中央突出或凹陷段上。栅极堆叠设置在覆盖层区域上。源极/漏极区域设置在半导体鳍片的一对突出的外部段中。

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