首页> 外国专利> AQUEOUS LOW ABRASION GRAIN SILICA SLURRY AND AMINE CARBOXYLIC ACID COMPOSITION FOR USE IN SHALLOW TRENCH ISOLATION SEPARATION, AND MANUFACTURING METHOD AND APPLICATION METHOD THEREOF

AQUEOUS LOW ABRASION GRAIN SILICA SLURRY AND AMINE CARBOXYLIC ACID COMPOSITION FOR USE IN SHALLOW TRENCH ISOLATION SEPARATION, AND MANUFACTURING METHOD AND APPLICATION METHOD THEREOF

机译:用于浅沟隔离的低磨粒硅酸水和胺羧酸组合物及其制造方法和应用方法

摘要

To provide an aqueous silica slurry capable of oxide dishing control and oxide:nitride removal speed selection ratio used for shallow trench isolation (STI) applications.SOLUTION: There is provided an aqueous chemical mechanical flattening (CMP) polishing composition containing a colloidal silica having zeta potential of +5 to +50 mV, and one or more aminosilane group, preferably an extensible, flexible or knotting colloidal silica, more preferably such particle containing a cationic nitrogen atom; and at least an amino heterocyclic carboxylic acid having isoelectric point (pI) of 2.5 to 5, preferably 3 to 4. The composition has pH of 2.5 to 5.3. Preferably the amine heterocyclic carboxylic acid is amine-containing heterocyclic monocarboxylic acid such as nicotinic acid, picolinic acid, or isonicotinic acid. The composition can enhance removal speed ratio of oxide;nitride.SELECTED DRAWING: None
机译:为了提供一种能够控制氧化物凹陷性和用于浅沟槽隔离(STI)应用的氧化物:氮化物去除速度选择比的水性二氧化硅浆料。解决方案:提供了一种水性化学机械平坦化(CMP)抛光组合物,其包含具有zeta的胶体二氧化硅电位为+5至+ 50mV,并且具有一个或多个氨基硅烷基团,优选为可延展的,柔性的或打结的胶体二氧化硅,更优选地,这种包含阳离子氮原子的颗粒;至少一个等电点(pI)为2.5至5,优选为3至4的氨基杂环羧酸。该组合物的pH为2.5至5.3。优选地,胺杂环羧酸是含胺的杂环单羧酸,例如烟酸,吡啶甲酸或异烟酸。该组合物可以提高氧化物,氮化物的去除速度比。

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