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Wafer support, SiC epitaxial wafer manufacturing apparatus and method including the same

机译:晶片支撑体,SiC外延晶片制造装置以及包括该晶片支撑体的方法

摘要

PROBLEM TO BE SOLVED: To provide a wafer support, a manufacturing device, and a manufacturing method, capable of efficiently and sufficiently reducing epitaxial crowning and also capable of making a carrier concentration in a wafer surface uniform.SOLUTION: A wafer support of the present invention is a wafer support used in a chemical vapor deposition device that grows an epitaxial film on a principal surface of a wafer by a chemical vapor deposition method. The wafer support has: a wafer-mounting surface on the top face of which a substrate is mounted; and a wafer-supporting part that rises up so as to surround the periphery of a wafer to be mounted. The height from a portion farthest from the wafer-mounting surface on the top surface of the wafer-support part on a reaction space side to the principal surface of the wafer mounted on the wafer-mounting surface is 1 mm or more. At least a part of the wafer-support part is formed of a material containing a part of constituent elements of the epitaxial film.SELECTED DRAWING: Figure 1
机译:解决的问题:提供一种晶片支撑件,制造装置和制造方法,该晶片支撑件,制造装置和制造方法能够有效且充分地减少外延凸度并且还能够使晶片表面中的载流子浓度均匀。本发明是用于化学气相沉积装置中的晶片支撑件,其通过化学气相沉积方法在晶片的主表面上生长外延膜。晶片支撑件具有:晶片安装表面,在该晶片安装表面的顶面上安装有基板;晶片支撑部以围绕要安装的晶片的周围的方式立起。从反应空间侧的晶片支撑部的顶表面上的最远离晶片安装表面的部分到安装在晶片安装表面上的晶片的主表面的高度为1mm以上。晶片支撑部分的至少一部分由包含外延膜的一部分构成元素的材料形成。图1

著录项

  • 公开/公告号JP6601956B2

    专利类型

  • 公开/公告日2019-11-06

    原文格式PDF

  • 申请/专利权人 昭和電工株式会社;

    申请/专利号JP20150246723

  • 发明设计人 乘松 潤;武藤 大祐;

    申请日2015-12-17

  • 分类号H01L21/205;C23C16/42;C23C16/458;C30B29/36;C30B25/12;

  • 国家 JP

  • 入库时间 2022-08-21 12:20:23

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