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Method of stress relaxation in an antireflective coated cap wafer of infrared focal plane array wafer level packaged

机译:封装红外焦平面阵列晶圆级防反射涂层盖晶圆中应力松弛的方法

摘要

Methods for reducing wafer bow induced by an anti -reflective coating of a cap wafer are provided. The method may utilize a shadow mask having at least one opening therein that is positioned opposite recessed regions in a cap wafer. The method may further include depositing at least one layer of an anti-reflective coating material through the shadow mask onto a planar side of a cap wafer to provide a discontinuous coating on the planar side.
机译:提供了减少由盖晶片的抗反射涂层引起的晶片弯曲的方法。该方法可以利用其中具有至少一个开口的荫罩,该荫罩位于盖晶片中的凹入区域的对面。该方法可以进一步包括通过荫罩将至少一层抗反射涂层材料沉积到盖晶片的平坦侧上,以在平坦侧上提供不连续的涂层。

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