Method of stress relaxation in wafer-level packaged infrared focal plane array anti-reflection coated cap wafer

摘要

A method is provided for reducing wafer bow induced by an anti-reflective coating on a cap wafer. The method may utilize a shadow mask having at least one opening positioned opposite the recessed area of the cap wafer. The method may further include depositing at least one anti-reflective coating material on the planar side of the cap wafer through the shadow mask and disposing a discontinuous coating on the planar side.