PRINTING METHOD OF LASER MARK, MANUFACTURING METHOD OF SILICON WAFER WITH LASER MARK, AND SILICON WAFER WITH LASER MARK

摘要

To provide a printing method of a laser mark capable of heightening flatness of a wafer outer circumferential part furthermore than hitherto.SOLUTION: In a method for printing of a laser mark having a plurality of dots on a silicon wafer, each of the plurality of dots is formed by the first step (step S1) for radiating a laser beam with the first beam diameter to a prescribed position of a wafer outer circumferential part of the silicon wafer, and by the second step (step S2) for radiating the laser beam with the second beam diameter smaller than the first beam diameter to the prescribed position.SELECTED DRAWING: Figure 1