Wafer-scale integration of group III-V lasers on silicon using transfer printing of epitaxial layers

摘要

The hard-drive and electronic industries can benefit by using the properties of light for power transfer and signalling. However, the integration of silicon electronics with lasers remains a challenge, because practical monolithic silicon lasers are not currently available. Here, we demonstrate a strategy for this integration, using an elastomeric stamp to selectively release and transfer epitaxial coupons of GaAs to realize III-V lasers on a silicon substrate by means of a wafer-scale printing process. Low-threshold continuous-wave lasing at a wavelength of 824 nm is achieved from Fabry-érot ridge waveguide lasers operating at temperatures up to 100°C. Single and multi-transverse mode devices emit total optical powers of >60 mW and support modulation bandwidths of >3 GHz. This fabrication strategy opens a route to the low-cost integration of III-V photonic devices and circuits on silicon and other substrates.