首页> 外国专利> Three-dimensional resistive random access memory device containing selectively grown amorphous silicon-containing barrier and method of making the same

Three-dimensional resistive random access memory device containing selectively grown amorphous silicon-containing barrier and method of making the same

机译:包含选择性生长的含非晶硅的势垒的三维电阻式随机存取存储器件及其制造方法

摘要

An alternating stack of insulating layers including a silicon oxide material and electrically conductive layers is formed over a substrate. Sidewalls of the insulating layers are selectively silylated with a chemical including at least one silyl group without silylating sidewalls of the electrically conductive layers. Silicon-containing barrier material portions are formed by selectively growing a first silicon-containing barrier material from surfaces of the electrically conductive layers without growing the first silicon-containing barrier material from silylated surfaces of the insulating layers. A memory material layer is formed on the silicon-containing barrier material portions and the sidewalls of the insulating layers. A vertical conductive line is formed on the memory material layer.
机译:包括氧化硅材料和导电层的绝缘层的交替堆叠形成在衬底上方。绝缘层的侧壁被包括至少一个甲硅烷基的化学物质选择性地甲硅烷基化而不使导电层的侧壁甲硅烷基化。通过从导电层的表面选择性地生长第一含硅的阻挡材料而不从绝缘层的甲硅烷基化的表面生长第一含硅的阻挡材料来形成含硅的阻挡材料部分。在含硅的阻挡材料部分和绝缘层的侧壁上形成存储材料层。在存储材料层上形成垂直导线。

著录项

  • 公开/公告号US10354859B1

    专利类型

  • 公开/公告日2019-07-16

    原文格式PDF

  • 申请/专利权人 SANDISK TECHNOLOGIES LLC;

    申请/专利号US201815920793

  • 申请日2018-03-14

  • 分类号H01L21/02;H01L27/24;H01L45;G11C13;H01L21/8229;H01L21/8238;H01L21/8234;H01L21/822;H01L21/8232;

  • 国家 US

  • 入库时间 2022-08-21 12:16:25

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