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High-electron-mobility transistors with counter-doped dopant diffusion barrier

机译:具有反掺杂掺杂剂扩散势垒的高电子迁移率晶体管

摘要

III-V compound semiconductor devices, such transistors, may be formed in active regions of a III-V semiconductor material disposed over a silicon substrate. A counter-doped portion of a III-V semiconductor material provides a diffusion barrier retarding diffusion of silicon from the substrate into III-V semiconductor material where it might otherwise behave as electrically active amphoteric contaminate in the III-V material. In some embodiments, counter-dopants (e.g., acceptor impurities) are introduced in-situ during epitaxial growth of a base portion of a sub-fin structure. With the counter-doped region limited to a base of the sub-fin structure, risk of the counter-dopant atoms thermally diffusing into an active region of a III-V transistor is mitigated.
机译:诸如晶体管的III-V族化合物半导体器件可以形成在布置在硅衬底上方的III-V族半导体材料的有源区域中。 III-V半导体材料的反掺杂部分提供了扩散阻挡层,阻止了硅从衬底到III-V半导体材料中的扩散,否则它可能会表现为III-V材料中的电活性两性污染物。在一些实施方案中,在子鳍结构的基部的外延生长期间将反掺杂剂(例如,受体杂质)原位引入。通过将反掺杂区域限制为子鳍结构的基极,减轻了反掺杂原子热扩散到III-V晶体管的有源区域中的风险。

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