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FinFET device with high-k metal gate stack

机译:具有高k金属栅极堆叠的FinFET器件

摘要

The present disclosure provides a semiconductor device that includes a substrate, a first fin structure over the substrate. The first fin structure includes a first semiconductor material layer, having a semiconductor oxide layer as its outer layer, as a lower portion of the first fin structure. The first semiconductor has a first width. The first fin structure also includes a second semiconductor material layer as an upper portion of the first fin structure. The second semiconductor material layer has a third width, which is substantially smaller than the first width. The semiconductor structure also includes a gate region formed over a portion of the first fin and a high-k (HK)/metal gate (MG) stack on the substrate including wrapping over a portion of the first fin structure in the gate region.
机译:本公开提供了一种半导体器件,其包括衬底,在衬底上方的第一鳍结构。第一鳍结构包括作为第一鳍结构的下部的第一半导体材料层,该第一半导体材料层具有半导体氧化物层作为其外层。第一半导体具有第一宽度。第一鳍结构还包括第二半导体材料层,作为第一鳍结构的上部。第二半导体材料层具有第三宽度,该第三宽度基本上小于第一宽度。半导体结构还包括形成在第一鳍片的一部分上方的栅极区域和衬底上的高k(HK)/金属栅极(MG)堆叠,包括在栅极区域中包裹在第一鳍片结构的一部分上方。

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