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Fabricating raised source drain contacts of a CMOS structure

机译:制造CMOS结构的凸起的源极漏极触点

摘要

The invention relates to a method for forming a field effect transistor. The method comprises providing a substrate with a channel layer, forming a gate stack structure on the channel layer, forming first sidewall spacers, forming a raised source and a raised drain on the channel layer and forming second sidewall spacers above the raised source and the raised drain. The method further includes depositing in a an insulating dielectric layer above the gate stack structure, the first sidewall spacers and the second sidewall spacers, planarization of the insulating dielectric layer and selectively etching the second sidewall spacers. Thereby contact cavities are created on the raised source and the raised drain. The method further includes forming a source contact and a drain contact by filling the contact cavities. The invention also concerns a corresponding computer program product.
机译:本发明涉及一种形成场效应晶体管的方法。该方法包括:向衬底提供沟道层;在沟道层上形成栅堆叠结构;形成第一侧壁间隔物;在沟道层上形成凸起的源极和凸起的漏极;以及在凸起的源极和凸起的上方形成第二侧壁间隔物。排水。该方法进一步包括在栅极堆叠结构上方的第一侧壁间隔物和第二侧壁间隔物的绝缘介电层中沉积,绝缘介电层的平坦化以及选择性地蚀刻第二侧壁间隔物。由此在升高的源极和升高的漏极上产生接触腔。该方法还包括通过填充接触腔来形成源极接触和漏极接触。本发明还涉及相应的计算机程序产品。

著录项

  • 公开/公告号US10304934B2

    专利类型

  • 公开/公告日2019-05-28

    原文格式PDF

  • 申请/专利权人 INTERNATIONAL BUSINESS MACHINES CORPORATION;

    申请/专利号US201816100353

  • 申请日2018-08-10

  • 分类号H01L21/3105;H01L21/768;H01L29/786;H01L29/417;H01L29/08;H01L29/06;H01L29/161;H01L29/20;H01L29/66;H01L21/02;H01L21/311;H01L21/321;H01L21/285;

  • 国家 US

  • 入库时间 2022-08-21 12:13:28

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