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Fluorine-containing plasma polymerized HMDSO for OLED thin film encapsulation
Fluorine-containing plasma polymerized HMDSO for OLED thin film encapsulation
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机译:用于OLED薄膜封装的含氟等离子体聚合HMDSO
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摘要
Methods for forming an OLED device are described. An encapsulation structure having organic buffer layer sandwiched between barrier layers is deposited over an OLED structure. The buffer layer is formed with a fluorine-containing plasma. The second barrier layer is then deposited over the buffer layer. Additionally, to ensure good adhesion, a buffer adhesion layer is formed between the buffer layer and the first barrier layer. Finally, to ensure good transmittance, a stress reduction layer is deposited between the buffer layer and the second barrier layer.
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