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Multilevel via placement with improved yield in dual damascene interconnection
Multilevel via placement with improved yield in dual damascene interconnection
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机译:在双镶嵌互连中进行多级通孔布局以提高良率
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摘要
A method of operating a computer system to improve via electromigration in an integrated circuit with multilevel interconnect. A method of operating a computer system to improve via electromigration in an integrated circuit with multilevel interconnect using via priority groups.
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