首页> 外国专利> Integrated circuits employing a field gate(s) without dielectric layers and/or work function metal layers for reduced gate layout parasitic resistance, and related methods

Integrated circuits employing a field gate(s) without dielectric layers and/or work function metal layers for reduced gate layout parasitic resistance, and related methods

机译:使用没有介电层和/或功函数金属层的场栅极以减小栅极布局寄生电阻的集成电路以及相关方法

摘要

Integrated circuits employing a field gate(s) without dielectric layers and/or work function metal layers for reduced gate layout parasitic resistance, and related methods are disclosed. At least a portion of the dielectric layers and/or work function metal layers present in active gate(s) is not present in a field gate(s) of a gate in a circuit cell. The field gate(s) have more conductive gate material than the active gate(s). In this manner, the increased volume of gate material in the field gate(s) reduces gate layout parasitic resistance. The active gate(s) retains the dielectric layers and/or work function metal layers to effectively isolate the gate material from a channel of a FET formed from the circuit cell to provide effective channel control. Reducing gate layout parasitic resistance can reduce current (I) resistance (R) (IR) drop to achieve the desired drive strength in the integrated circuit.
机译:公开了采用不具有电介质层和/或功函数金属层的场栅极以减小栅极布局寄生电阻的集成电路,以及相关方法。存在于有源栅中的介电层和/或功函数金属层的至少一部分不存在于电路单元中的栅极的场栅中。场栅比有源栅具有更多的导电栅材料。以此方式,场栅极中栅极材料的增加的体积减小了栅极布局的寄生电阻。有源栅极保留介电层和/或功函数金属层,以有效地将栅极材料与由电路单元形成的FET的沟道隔离,以提供有效的沟道控制。减小栅极布局的寄生电阻可以减小电流(I)电阻(R)(IR)的下降,从而在集成电路中实现所需的驱动强度。

著录项

  • 公开/公告号US10411091B1

    专利类型

  • 公开/公告日2019-09-10

    原文格式PDF

  • 申请/专利权人 QUALCOMM INCORPORATED;

    申请/专利号US201816034746

  • 发明设计人 MUSTAFA BADAROGLU;KERN RIM;

    申请日2018-07-13

  • 分类号H01L29/06;H01L29/66;H01L27/092;H01L29/417;H01L29/40;H01L29/78;

  • 国家 US

  • 入库时间 2022-08-21 12:11:49

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