首页> 外国专利> INTEGRATED CIRCUITS EMPLOYING VARIED GATE TOPOGRAPHY BETWEEN AN ACTIVE GATE REGION(S) AND A FIELD GATE REGION(S) IN A GATE(S) FOR REDUCED GATE LAYOUT PARASITIC CAPACITANCE, AND RELATED METHODS

INTEGRATED CIRCUITS EMPLOYING VARIED GATE TOPOGRAPHY BETWEEN AN ACTIVE GATE REGION(S) AND A FIELD GATE REGION(S) IN A GATE(S) FOR REDUCED GATE LAYOUT PARASITIC CAPACITANCE, AND RELATED METHODS

机译:在门中使用有源门区域和场门区域之间的可变门地形的集成电路,以减小门布局寄生电容,以及相关方法

摘要

Integrated circuits employing varied gate topography between an active gate region(s) and a field gate region(s) in a gate(s) for reduced gate layout parasitic capacitance, and related methods, are disclosed. In exemplary aspects, the gate topography (e.g., height) of a gate in a circuit cell used to form gates for devices formed therein to form an integrated circuit is varied between an active gate and a field gate(s) of the gate. In this manner, the overall volume of material in the gate can be reduced due to the reduction in volume of the field gate(s) to reduce gate layout parasitic capacitance. Reducing gate layout parasitic capacitance in a circuit cell can reduce the overall parasitic capacitance of an integrated circuit formed from the circuit cell to achieve the desired integrated circuit delay performance.
机译:公开了在一个或多个栅极中的一个或多个有源栅极区域和一个或多个场栅极区域之间采用变化的栅极形貌以减小栅极布局寄生电容的集成电路以及相关方法。在示例性方面中,用于形成在其中形成的器件以形成集成电路的栅极的电路单元中的栅极的栅极形貌(例如,高度)在有源栅极和该栅极的场栅极之间变化。以此方式,由于场栅极的体积的减小,可以减小栅极中材料的总体积,以减小栅极布局的寄生电容。减小电路单元中的栅极布局寄生电容可以减小由电路单元形成的集成电路的总体寄生电容,以实现期望的集成电路延迟性能。

著录项

  • 公开/公告号US2020020688A1

    专利类型

  • 公开/公告日2020-01-16

    原文格式PDF

  • 申请/专利权人 QUALCOMM INCORPORATED;

    申请/专利号US201816034703

  • 发明设计人 MUSTAFA BADAROGLU;KERN RIM;

    申请日2018-07-13

  • 分类号H01L27/088;H01L29/08;H01L29/10;H01L29/423;H01L29/40;H01L21/8234;H01L29/66;H01L21/027;H01L21/3213;H01L27/02;

  • 国家 US

  • 入库时间 2022-08-21 11:23:05

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号